Mechanical Analysis of Electronic Packaging Systems

Design-Analysis (Thermal and Mechanical) Integration Research for Electronic Packaging

Simulating the characteristics of electronic packages like thermal resistance, thermomechanical stress distribution and electromagnetics is important to guide and verify their design. Since packages consist of densely packed components of varied materials and shapes, the simulation time for generating their finite element analysis (FEA) models can span from hours to days. This paper overviews e...

Thermal and Thermomechanical Analysis and Testing of Electronic Packaging Systems

A comprehensive thermal and mechanical modeling and experimentation program in advanced packaging has led to the systematic thermomechanical analysis of very large scale integrated device packages, board-level structures, and surface-mounted electronic systems. Model validation and analytical results have been correlated with data from extensive experimental testing, and new techniques have bee...

Vibration Analysis of Global Near-regular Mechanical Systems

Some near-regular mechanical systems involve global deviations from their corresponding regular system. Despite extensive research on vibration analysis (eigensolution) of regular and local near-regular mechanical systems, the literature on vibration analysis of global near-regular mechanical systems is scant. In this paper, a method for vibration analysis of such systems was developed using Kr...

Modern Electronic Packaging Technology

A view of modern electronic packaging technology is presented along with its applications at APL. Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs may vary at each level, but they all must provide electrical interconnection, thermal management, and mechanical and environmental protecti...

Opto - Electronic Packaging